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The SUSS MJB 3 Mask Aligner is designed for high resolution photolithography in a laboratory or pilot production environment. The MJB 3 product line offers unsurpassed flexi bility in the handling of irregularly shaped substrates of differing thicknesses, as well as standard size wafers up to 3" diameter.
The manual Z-movement allows a maximum sub-strate thickness of up to 4mm. XY alignment stage The mechanically clamped mask holder is designed for quartz, glass or film masks. It is equipped with vacuum clamping for the mask. Mask holders and chucks are easily exchangeable. Existing MJB3 equipment can be used on the MJB4 with a special mask ...
KARL SUSS MJB3 UV400 Mask Aligner The mask aligner is used in photolithography to transfer features. Update 4/1/2012 We now have available an i-line filter (365nm) and a new dual detector pair. The new detector pair is on the left, the previous detector pair on the right.
Page | 5 5. UNLOAD WAFER -Wait till the message on the LCD screen appears “UNLOAD SUBSTRATE FROM THE SLIDE”-Pull out transport slide completely; otherwise the vacuum will be on.-Unload wafer and move the transport slide into the machine -If you would like to expose additional wafers, perform step 3-5 6. UNLOAD MASK -Hit the CHANGE MASK key and the mask holder will be released.
OPERATION MANUAL Model 200 MASK ALIGNER TABLE TOP SERIES 685 RIVER OAKS PARKWAY SAN JOSE, CA 95134 oainet [email protected] 408/232-0600 P/N 0200-750-01, Rev. B 05/29/01 . 2 Table of Contents
SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as …Max. Substrate Size: 100 x 100 mm
SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as …
3. Preparation: Mask Loading • Press the key “CHANGE MASK” to unclamp the mask holder from the frame. • Take the mask holder out of the frame, rotate it and put it on the small table left side of the MA6/BA6. • Fit properly the mask on the mask holder, check the mechanical clamp. y-axis x …File Size: 982KB
Karl Suss MJB-3 Mask Aligner User’s Manual Version Date Sections Affected Author 1.0 7-17-08 All Chapters J. Pulecio . ... The Mask Holder should be placed face up on the table v. You should see the vacuum grove. f. Place you mask, MASK SIDE UP, a top of the Mask Holder.
Mask Aligner Highest precision for applications with thick and thin resists. The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike.
EVG 620 MASK ALIGNER consisting of: - Model: EVG620 - Manual Mask Aligner - Topside Alignment (TSA) - Backside Ailgnment (BSA) - Automatic Alignment - Up to 6"/150mm Wafer Capable (with proper chuck) - Objectives (Qty 2) - Vacuum Chuck: request at time of order - Maskholder: request at time of order - Mask Load Frame: request at time of order
The NXQ8000 Series Mask Aligner is a scalable, high volume production model that combines an ‘open architecture’ modular design with precision alignment and exposure features for unmatched versatility.
MANUAL MASK ALIGNER The MJB4 Mask Aligner from SUSS MicroTec is the per-fect system for research institutes, universities and small volume production. Easy to use and compact in size, the SUSS MJB4 has set industry standards specifically for processing of small wafers/substrates or pieces and offers limited budgets.
This SUSS MicroTec highly automated mask aligner platform for 200/300mm wafers is designed for high-volume manufacturing exposing geometries from 3-100 µm.
MANUAL MASK ALIGNER MJB4 · 04/2013 · BR_MJB4_2013 · V1 . 2 QtUALi Y meetS iNNoVAtioN + Fast and highly accurate alignment with SUSS Singlefield or Splitfield microscope + HR Optics enables high resolution prints down to 0.5 μm + The universal optics option (UV250/300/400) for fast switching
This is a manual mask aligner with 365 nm optics. It is a convenient instrument for small samples – 7x7mm – as well as wafers from 50mm to 100mm in diameter. It can accommodate mask plates as small as 75mm and as large as 125mm. The system can be upgraded for 150mm wafers and backside alignment. Reference:
Based on SUSS MicroTec's production proven mask aligner design the MA100/150e Gen2 enables exceptional process scalability and fast time-to-market for new device designs, while the industry leading throughput of 145 wafers per hour reduces cycle time. The …
Ensure correct mask orientation and check alignment accuracy at multiple alignment marks across the mask. ( Note that horizontal alignment accuracy with a stereomicroscope is low, because each eye’s optical path is angled 5 – 8 degrees, whereas vertical alignment is unaffected.
1. Handle the mask by the edges, it is bad practice to touch the mask’s exposure area. Also a fresh pair of gloves before handling the mask is a good idea 2. Inspect your mask under the microscope and make sure it is clean. 3. Push “Change mask…” 4. Slide out the mask frame, flip it over and put it on the wing-table to the left of the ...
The MJB4 is a mask/wafer aligner for research and development, designed to align and expose wafers up to 4 inch (100 mm) diameter. Wafers, coated with photosensitive resists (PR), are exposed through a glass/chrome mask using a short (few seconds) pulse of UV radiation from a mercury (Hg) lamp, with spectral lines at 365nm, 405nm and 436nm.
The NXQ8000 Series Mask Aligner is ideal for Microelectronics, LED / HB LED, 3D IC, SIOP, WLP, 2.5D Interposer, MEMS, BioMEMS, MicroFluidics, Compound Semi, Solar (HCPV), and Optoelectronics applications. Standard Features. Wafer sizes from Pieces up to 200mm diameter Manual Load, 50mm up to 200mm Robot Load; Standard on Auto Load Systems:
Suss MJB3 Mask Aligner User Manual Important Notes 1. Don’t turn off the lamp power. 2. Don’t turn off the machine power (it will shut off the N2 to the lamp house therefore damage the lamp). 3. Do not use any type of tapes to cover the vacuum holes on substrate chuck. 4. Exposure dosage may vary from one machine to another. 5.File Size: 36KB
High Topography Exposure with SUSS Mask Aligners The solution for exposure over high topography: Enabling highly reliable interconnects with a trench depth up to 400 µm can be achieved on a SUSS Mask Aligner with Large Exposure Gap Optics. Laboratory & pilot production equipment Manual SUSS Mask Aligners are regarded as the benchmark for ...
Karl Suss MA6 Mask Aligner SOP Safety UV Exposure: The high energy light produced by the high pressure Mercury Xenon lamp can cause eye damage and skin burns. Be sure that the light guards around the exposure area are not removed, and that the high pressure lamp and exposure path are enclosed. Do not looking directly at the mask during exposure.File Size: 409KB
The Karl Suss MA6 is a top and bottom side mask aligner used for fine lithography down to 1 micron or below. 2. 350 W mercury arc lamp i-line (365nm) with "smart power supply" is capable of operating in constant power mode, or constant intensity mode.
View and Download Karl Suss MA6 operating manual online. MASK ALIGNER Nano Fabrication Unit. MA6 Laboratory Equipment pdf manual download.
Used Mask Aligners & Bonders Equipment Equipment > Process Equipment > Mask Aligners & Bonders > Page 2 ClassOne Equipment is a leader in the development and refurbishment of used high-quality Mask and Bond Aligners used by research, development and production facilities worldwide.
MASK ALIGNER Serial No. -----Service Manual 1. GENERAL DESCRIPTION AND PRINCIPLES OF OPERATION 2. UTILITIES AND MACHINE DIMENSIONS 3. MACHINE SPECIFICATIONS 4. BASIC ADJUSTMENT PROCEDURES 5. PREVENTIVE MAINTENANCE 6. REPLACEMENT PARTS IDENTIFICATION MANUAL 7. ELECTRICAL AND PENUMATIC DRAWINGS This Service Manual is …
OPERATION MANUAL Model 800, The ... The “MBA” Mask Aligner Standard/Motor-Z 685 RIVER OAKS PARKWAY SAN JOSE, CA 95134 oainet [email protected] 408/232-0600 0420-758-01, Rev.D 09/26/11 . Manual PN: 0420-758-01, Rev: D MANUAL MDL 800MBA STD/MTR-Z OPERATION i MBA- MODEL 800 MASK ALIGNER Definitions of the following symbols and words …
4” Manual Mask Aligner Our manual control MDA-400M series standard feature UV Light source 350 nm to 450 nm, 365 nm Intensity: 20-30 mW/cm2 and a beam size of 6.25” x
Karl Suss MA6 Mask Aligner SOP Safety UV Exposure: The high energy light produced by the high pressure Mercury Xenon lamp can cause eye damage and skin burns. Be sure that the light guards around the exposure area are not removed, and that the high pressure lamp and exposure path are enclosed. Do not looking directly at the mask during exposure.
DOCUMENT: OAI MODEL 800 MASK ALIGNER OPERATING PROCEDURE Version 3.0 3 1 INTRODUCTION 1.1 Scope These procedures apply to 800 MBA MASK ALIGNER. All maintenance should follow the procedures set forth in the manufacturer‟s maintenance and operations manuals. This document is for reference only.
Suss MJB3 Mask Aligner User Manual Important Notes 1. Don’t turn off the lamp power. 2. Don’t turn off the machine power (it will shut off the N2 to the lamp house therefore damage the lamp). 3. Do not use any type of tapes to cover the vacuum holes on substrate chuck. 4. Exposure dosage may vary from one machine to another. 5.
Mask Aligner Karl Suss MA6 user manual (2017/10/06) stage micrometers to 10 (ten). Fill out the log sheet (μmeter ).☑ 10.2. Move the microscope up over the safety line with the Z knob at the left of the base of the microscope. 10.3. Press [CHANGE MASK], take out the mask holder and put it on the mask station. 10.4. Press [ENTER] and take out ...
conventional mask aligners, the geometry of the effe ctive light source which corresponds to the angular spectru m of ill uminatio n cannot be changed. Moreover , manual alignment systems are ...
With the development of this new mask aligner, OAI meets the growing challenge of a dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production. Built on OAI’s proven modular platform, the Model 800E is an enhanced, high-performance, high-resolution lithography system which ...
Mask aligner, 8” 2000 Watt NUV bulb 365nm / 400nm Wavelength over 20 mW / Cm² 9" x 9" Square final l...
Karl Suss MA6 Mask Aligner . 1. Picture and Location. Th. is. tool is located at NFF Room 2240 Cleanroom Class 100. 2. Process Capabilities. 2.1. Cleanliness Standard: Suss MA6#1 Mask Aligner is classified as a “Non-Standard” equipment; Suss MA6#2 Mask Aligner is classified as a “Clean/Semi-Clean”. 2.2. Substrate Size: TSA is >5mm. 2
account when designing and constantly enhancing EVG’s mask aligner product portfolio. Innovation drives our daily business along with our philosophy, which enables us to think outside the box. Multi-purpose systems optimized to your needs Our mask alignment systems are designed for quick and easy conversion from mask alignment to bond alignment.
No damage to mask and wafer in calibration. Significant improvement in gap accuracy. Interactive operation on PC monitor is adopted. High precision alignment based on "assist lines" is possible. SMA-600M is a manual mask aligner for R&D and multiproduct production field, which adopts a clear optical system and fully non-contact calibration unit.
MA/BA Gen 4 Pro Series. The MA/BA Gen4 Pro mask and bond aligner is the all-rounder of all SUSS MicroTec’s semi-automated mask aligners, and thus offers a wide range of application possibilities.It supports substrate sizes of up to 150 mm and 200 mm. Thanks to numerous tools and options, as well as settable process parameters, it offers maximum flexibility for research and development or ...
KARL SUSS MANUAL MASK ALIGNER 150 MM. Manual Mask Aligner The Karl Suss MA 150M Manual Mask Aligner is a mask alignment and exposure system which offers unsurpassed precision and versatility when handling wafers up to 150 mm in diameter. In addition to this Karl Suss MA 150M, Capovani Brothers Inc. stocks a wide range of used mask aligners.
View and Download Karl Suss MA6 operating manual online. MASK ALIGNER Nano Fabrication Unit. MA6 Laboratory Equipment pdf manual download.
2. Manual contact Mask Aligners. 3. Can handle silicon wafer, glass, chemical compound, film, and various other materials as well as irregular-sized substrates. 4. We have verification data on various resists. Product Specifications
Apr 03, 2016 · Unpacking and removing the transport security locks shall only be done Mask aligner: 0.1 – 10 mm (max 2 mm for bottom side alignment). is transferred to the wafer by using a mask aligner. The machine can be operated manually, The EVG620 mask aligner is a cassette-to-cassette mask.EVG®620 Automated Mask Alignment System.
IQ Aligner® Mask Alignment System Wafer size up to 300mm High resolution top and bottom side splitfield microscopes for double-side alignment 100% contactless proximity processing capability Mask top loading Minimized footprint Manual or automated substrate loading capability Field upgradeable from manual to automated version Automated mask ...
follow the procedures set forth in the manufacturer’s maintenance and operations manuals. This document is for reference only. Personnel should be trained by authorized staff before operating MJB3 UV400 mask aligner. 1.2 Description The SUSS MJB3 UV400 mask aligner is designed for high resolution photolithography in a laboratory environment.
ClassOne Equipment warrants all non-consumable parts for 90 days (unless otherwise stated). This warranty commences upon documented delivery. This warranty does not apply to defects caused by negligence, improper installation, misuse, unauthorized repair, accident or alteration by the purchaser, or damage during shipping.
Karl Suss MA6 Manuals Manuals and User Guides for Karl Suss MA6. We have 2 Karl Suss MA6 manuals available for free PDF download: ... Manual (24 pages) Mask Aligner
Karl Suss MJB3 Precision High Performance Mask Alignment and Exposure System. Easy to use manual mask aligner. System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. (Ask a salesperson about available mask and chuck sizes). Hard or soft contact modes. High precision alignment stage X,Y, Theta.
Home → Products → Mask Aligner Products → NXQ9000 Series – Affordable large area photolithography system Learn more about the NXQ 9000 high volume roll to roll photolithography system The NXQ9000 series is the first-of-its-kind 1x proximity stepper in the marketplace for full field or step and repeat exposures.
SUSS MA8 / BA8 BSA MASK ALIGNER consisting of: - Model: MA8 / BA8 - Manufacturer: Suss MicroTec / Karl Suss - Configured for Topside and Backside Alignment (BSA) - Splitfield Microscope - Power: 230V, 50/60 Hz - UV400 Optics (for 365nm and 405nm exposure) - Capable of Hard, Soft, Vacuum, and Proximity Contact - 1000W Lamphouse - CIC1200 Power ...
Karl Suss MJB3 Precision High Performance Mask Alignment and Exposure System. Easy to use manual mask aligner. System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. (Ask a salesperson about available mask and chuck sizes). Hard or soft contact modes. High precision alignment stage X,Y, Theta. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.
4″ system with 4″dia., 3″ dia., and 5mm x 5mm chucks, and 5″x5″, 4″x4″, and 2″x2″ masks holders available Training Manual: Mask Aligner – Suss MJB4 Register to use NUFAB
ClassOne Equipment is a leader in the development and refurbishment of used high-quality Mask and Bond Aligners used by research, development and production facilities worldwide. ClassOne Equipment’s used mask and bond alignment systems perform high precision alignment for mask-to-wafer as well as wafer-to-wafer operations.
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